Direct-to-Chip Cooling
Up to 600 kW per rack. PUE < 1.04.
Two-phase direct-to-chip cooling designed for next-gen GPU heat loads, high-density racks, and closed-loop operation.
Two-phase direct-to-chip assemblies.
Rack-level cooling designed for closed-loop operation.
Available For Select Partners. Demonstration Units Are Available For Evaluation. Production Delivery Begins 2027.
Factory-Tested. Field-Commissioned. AI-Designed Components.
PER RACK
Non-PFAS
Closed Loop
Rack-level cooling for next-gen GPUs.
Designed for current and future GPU architectures with low pressure, closed-loop operation.
Dielectric
AI-designed, non-PFAS, non-toxic, low GWP, 0 ODP, engineered for GPU operating temperatures.
Redundancy
N+1 redundancy, leak detection, hot-swappable modules.
Benefits
Designed for high-density racks.
Supports up to 600 kW per rack with two-phase operation.
AI-designed dielectric: non-PFAS, low GWP, closed-loop system.
Enables PUE < 1.04 at the cooling layer.
Engagement
Cooling load modeling and rack layout review are required before final specification.
Factory acceptance testing validates leak detection, redundancy, and PUE contribution.
Talk to our team
Tell us your deployment timeline, site constraints, and target rack density. We'll come back with a technical scoping session and a proposal designed for your deployment.